Source: Tech – South China Morning PostHuawei Technologies has reshuffled the leadership of its in-house chip design unit, HiSilicon, at a time when China’s semiconductor industry is consolidating amid the escalating US-China tech war.
The Shenzhen-based Huawei unit has promoted Jeffery Gao, head of its Shanghai division, to the position of HiSilicon chairman. He replaced Eric Xu, deputy chairman of the overall Huawei group, who had also been leading the chip unit since 2008, according to the latest information from Chinese corporate…Read More