Source: Tech – South China Morning PostShanghai Biren Technology has started bookbuilding for its Hong Kong initial public offering (IPO), aiming to raise up to HK$4.85 billion (US$624 million), as Chinese chipmakers rush to list amid rising investor interest.
Biren, the mainland’s first graphics processing unit (GPU) developer to go public in Hong Kong, will start trading on January 2 – becoming the first new listing of 2026. The firm was offering 247.7 million shares between HK$17 and HK$19.60 each, according to its exchange filing…Read More