Source: Tech – South China Morning PostChinese storage makers, long known for packaging chips into modules, have been moving up the value chain into wafer-level operations, with the latest firm to make the jump investing 4.5 billion yuan (US$672 million) in an advanced packaging project.
The sum, which Shanghai-listed Biwin Storage Technology will pour into the third phase of its advanced packaging and testing project in Dongguan, in southern China’s Guangdong province, will exceed the 3.09 billion yuan it put into the first two…Read More