Source: Tech – South China Morning PostIntel Corp is spending US$7.1 billion on new chip packaging facilities in Malaysia, a major investment to ramp up its global footprint and address a crippling global chip shortage it expects to persist until 2023.The company is earmarking more than 30 billion ringgit toward expanding its capacity in the country, chief executive officer Pat Gelsinger told reporters Thursday. Part of that will bankroll a new packaging plant expected to begin production in 2024, he said.The project marks a big bet…Read More